Join Radrock and you will enjoy
Core world, new life
Radstone is committed to growing into a global leader in the field of RF and building the strongest Chinese chip, striving to become a leading enterprise in the industry, and creating value for the society through technological innovation.
Broad development platform
Internal training and internal promotion allow outstanding talents to stand out. There are both management and professional development channels, and the platform is broader.
Open and inclusive office culture
At Radrock, we encourage prosperity and continuous innovation; encourage risk-taking and tolerate failure; advocate competition, equality and openness; pay attention to cooperation and people-oriented. We believe that every star will shine here.
People-oriented
Talent is our only capital, and we believe that the harder you work, the luckier you are. Team travel, fitness exercises, daily afternoon tea, equity incentives..., more benefits are determined by you, and all your contributions can be rewarded.
Social recruitment
PE Engineer（NPI Engineer）
Number of recruits: 2
2023.06.08
Work location: Shenzhen
Job Responsibilities
1. Responsible for the confirmation of the project status and the preparation of the materials when the production is introduced in the early stage of trial production, and the technical status and technical documents of the R&D confirmation project, and preparing for the trial production;
2. Support the gradual introduction of new products to ensure risk assessment and control during the import process;
3. Follow up the product project plan, engineering schedule, test schedule, reliability results and mass production introduction;
4. Follow up the trial production progress and the problems that occur during the process, propose improvement plans, and finally ensure the project progress and shorten the project sample cycle;
5. Responsible for the summary of trial production, and collaborate with other functional departments to complete the process of vector production conversion of engineering samples;
6. Familiar with IC product reliability process, can analyze and improve product reliability anomalies.
7. Lead the introduction of the second supplier of products.
8. Keep abreast of the latest packaging technology and choose the best and most reliable packaging solutions, materials and suppliers in combination with different product characteristics;
Job Requirements
1. Bachelor degree or above;
2. Familiar with the packaging and testing process of IC products, with the ability to find and solve problems in the packaging and testing production process, RF products are preferred, and have a certain understanding of product packaging forms, basic forms and applications;
3. Familiar with IC product reliability testing standards and methods;
4. Understand the reliability testing process of new product verification and mass production monitoring (ORT)
5. More than 5 years of experience as an NPI engineer or packaging process engineer.
6. Understand quality tools such as SPC, 6 sigma, DFM, etc.
Please send your resume to this email: HR@radrocktech.com
Job Responsibilities
1. Responsible for the confirmation of the project status and the preparation of the materials when the production is introduced in the early stage of trial production, and the technical status and technical documents of the R&D confirmation project, and preparing for the trial production;
2. Support the gradual introduction of new products to ensure risk assessment and control during the import process;
3. Follow up the product project plan, engineering schedule, test schedule, reliability results and mass production introduction;
4. Follow up the trial production progress and the problems that occur during the process, propose improvement plans, and finally ensure the project progress and shorten the project sample cycle;
5. Responsible for the summary of trial production, and collaborate with other functional departments to complete the process of vector production conversion of engineering samples;
6. Familiar with IC product reliability process, can analyze and improve product reliability anomalies.
7. Lead the introduction of the second supplier of products.
8. Keep abreast of the latest packaging technology and choose the best and most reliable packaging solutions, materials and suppliers in combination with different product characteristics;
Job Requirements
1. Bachelor degree or above;
2. Familiar with the packaging and testing process of IC products, with the ability to find and solve problems in the packaging and testing production process, RF products are preferred, and have a certain understanding of product packaging forms, basic forms and applications;
3. Familiar with IC product reliability testing standards and methods;
4. Understand the reliability testing process of new product verification and mass production monitoring (ORT)
5. More than 5 years of experience as an NPI engineer or packaging process engineer.
6. Understand quality tools such as SPC, 6 sigma, DFM, etc.
Please send your resume to this email: HR@radrocktech.com
Test Engineer
Number of recruits: 2
2020.06.30
Work location: Shenzhen
Job Responsibilities
1. Responsible for the daily maintenance and software development of laboratory test instruments and systems;
2. Test the chip according to the test tasks formulated by R&D, including routine test, stability test, noise test, aging test, etc., and form a test report;
3. Build a test platform according to the needs of the test, and debug and analyze the abnormal conditions during the test;
4. Assist in the introduction and debugging of the chip mass production stage, and travel to the factory for system debugging and supervision according to the needs of the situation.
Job Requirements
1. The working period is more than 3 years;
2. Bachelor degree or above, major in electronic engineering;
3. Familiar with the principle of radio frequency communication, master the operation and principle of radio frequency test instruments, including KEYSIGHT signal source, spectrum analyzer and network analyzer;
4. Have relevant working experience in chip testing;
5. With programming experience, familiar with LabVIEW/C/C++/.NET/Matlab and other programming languages
Please send your resume to this email: HR@radrocktech.com
Job Responsibilities
1. Responsible for the daily maintenance and software development of laboratory test instruments and systems;
2. Test the chip according to the test tasks formulated by R&D, including routine test, stability test, noise test, aging test, etc., and form a test report;
3. Build a test platform according to the needs of the test, and debug and analyze the abnormal conditions during the test;
4. Assist in the introduction and debugging of the chip mass production stage, and travel to the factory for system debugging and supervision according to the needs of the situation.
Job Requirements
1. The working period is more than 3 years;
2. Bachelor degree or above, major in electronic engineering;
3. Familiar with the principle of radio frequency communication, master the operation and principle of radio frequency test instruments, including KEYSIGHT signal source, spectrum analyzer and network analyzer;
4. Have relevant working experience in chip testing;
5. With programming experience, familiar with LabVIEW/C/C++/.NET/Matlab and other programming languages
Please send your resume to this email: HR@radrocktech.com
FAE
Number of recruits: 4
2023.06.08
Work place: Shenzhen, Shanghai
Job Responsibilities
1. Responsible for customer project technical support (RF modem configuration, matching debugging and PA load optimization);
2. Solve customer-related technical and quality issues, and feedback customers' technical needs;
3. Cooperate with sales and R&D to complete customer project design in and follow up project status;
Job Requirements
1. Bachelor degree or above, major in communication and electronics;
2. More than three years of experience in RF design and debugging of mobile phones, modules and smart watches;
3. Familiar with the communication principles of GSM, WCDMA, LTE, and 3gpp radio frequency indicators;
4. Familiar with the operation of the comprehensive tester CMW500, AG8960, MT8820, VNA, SPA and other instruments;
5. Have platform hardware debugging experience, such as Qualcomm, MTK, Spreadtrum, ZTE Micro and ASR, familiar with related platform RF modem configuration is preferred.
Please send your resume to this email: HR@radrocktech.com
Job Responsibilities
1. Responsible for customer project technical support (RF modem configuration, matching debugging and PA load optimization);
2. Solve customer-related technical and quality issues, and feedback customers' technical needs;
3. Cooperate with sales and R&D to complete customer project design in and follow up project status;
Job Requirements
1. Bachelor degree or above, major in communication and electronics;
2. More than three years of experience in RF design and debugging of mobile phones, modules and smart watches;
3. Familiar with the communication principles of GSM, WCDMA, LTE, and 3gpp radio frequency indicators;
4. Familiar with the operation of the comprehensive tester CMW500, AG8960, MT8820, VNA, SPA and other instruments;
5. Have platform hardware debugging experience, such as Qualcomm, MTK, Spreadtrum, ZTE Micro and ASR, familiar with related platform RF modem configuration is preferred.
Please send your resume to this email: HR@radrocktech.com
Analog Circuit Design Engineer
Number of recruits: 4
2023.06.08
Work location: Shenzhen
Job Responsibilities
1. Participate in the research and development of new products as a circuit design engineer, including circuit design, simulation, etc.;
2. Guide layout work to ensure layout quality;
3. Complete the product development documents;
4. Participate in product testing and DEBUG.
Job Requirements
1. Master degree or above, major in analog or radio frequency microelectronics;
2. More than three years of relevant working experience in analog circuit design;
3. Proficiency in basic knowledge of analog circuits, experience in independently designing modules such as Bandgap, OPAMP, AD/DA, LDO is preferred, experience in SOI design is preferred, and experience in mass production is preferred;
4. Proficiency in cadence design environment, proficiency in ADS experience is preferred;
5. Good communication skills and team spirit, love technology, willing to innovate, proficient in reading English technical documents.
Please send your resume to this email: HR@radrocktech.com
Job Responsibilities
1. Participate in the research and development of new products as a circuit design engineer, including circuit design, simulation, etc.;
2. Guide layout work to ensure layout quality;
3. Complete the product development documents;
4. Participate in product testing and DEBUG.
Job Requirements
1. Master degree or above, major in analog or radio frequency microelectronics;
2. More than three years of relevant working experience in analog circuit design;
3. Proficiency in basic knowledge of analog circuits, experience in independently designing modules such as Bandgap, OPAMP, AD/DA, LDO is preferred, experience in SOI design is preferred, and experience in mass production is preferred;
4. Proficiency in cadence design environment, proficiency in ADS experience is preferred;
5. Good communication skills and team spirit, love technology, willing to innovate, proficient in reading English technical documents.
Please send your resume to this email: HR@radrocktech.com
RF Engineer
Number of recruits: 10
2023.06.08
Work place: Shenzhen, Shanghai
Job Responsibilities
1. RF module design, including R&D of terminal RF module products such as 2G, WCDMA, LTE, LTE+, and 5G C-Band;
2. RF power amplifier chip design, mainly including gallium arsenide HBT, gallium nitride and other chip designs.
Job Requirements
1. 25-35 years old, male or female;
2. Bachelor degree or above (inclusive), major in electronic engineering, microwave radio frequency;
3. Solid RF foundation, familiar with RF matching design and RF filter design;
4. Experience in electromagnetic simulation is preferred;
5. Those with active circuit design experience are preferred, such as RF power amplifier, low noise amplifier, etc.;
6. Proficiency in EM simulation, familiar with ADS, Cadence PCB and other design software;
7. Familiar with RF test equipment, such as signal source, spectrum analyzer, network analyzer, etc.;
8. Being conscientious and responsible, with strong sense of responsibility and strong professionalism;
9. Have team spirit and can work under pressure.
Please send your resume to this email: HR@radrocktech.com
Job Responsibilities
1. RF module design, including R&D of terminal RF module products such as 2G, WCDMA, LTE, LTE+, and 5G C-Band;
2. RF power amplifier chip design, mainly including gallium arsenide HBT, gallium nitride and other chip designs.
Job Requirements
1. 25-35 years old, male or female;
2. Bachelor degree or above (inclusive), major in electronic engineering, microwave radio frequency;
3. Solid RF foundation, familiar with RF matching design and RF filter design;
4. Experience in electromagnetic simulation is preferred;
5. Those with active circuit design experience are preferred, such as RF power amplifier, low noise amplifier, etc.;
6. Proficiency in EM simulation, familiar with ADS, Cadence PCB and other design software;
7. Familiar with RF test equipment, such as signal source, spectrum analyzer, network analyzer, etc.;
8. Being conscientious and responsible, with strong sense of responsibility and strong professionalism;
9. Have team spirit and can work under pressure.
Please send your resume to this email: HR@radrocktech.com
RFIC Design Engineer
Number of recruits: 9
2023.06.08
Work place: Shenzhen, Shanghai
Job Responsibilities
1. Responsible for the design of LNA, Switch, PA and other RF circuits and modules based on CMOS/SOI process;
2. Responsible for RF device and circuit layout design and post-imitation and packaging simulation verification, participating in RF device modeling and material design;
3. Responsible for test verification and laboratory debugging of RF circuits and modules;
4. Write product manuals, application documents, etc.
Job Requirements
1. Graduate degree or above, semiconductor physics and microelectronics and other related majors;
2. Familiar with related knowledge of microwave radio frequency/electromagnetic field, analog circuit, signal and system, communication system;
3. Familiar with the semiconductor (CMOS/SOI/GaAs/SiGe, etc.) process;
4. Skilled use of design tools such as ADS, Cadence and common test equipment, strong layout design experience and circuit test analysis ability;
5. Outstanding hands-on and active learning ability, good communication/teamwork ability;
6. Those with the following experience are preferred:
a. Have complete PA Module/LNA/Switch product development experience;
b. Proficient in laboratory test equipment operation and process;
c. Familiar with semiconductor devices, materials and processes;
d. Familiar with passive device design.
Please send your resume to this email: HR@radrocktech.com
Job Responsibilities
1. Responsible for the design of LNA, Switch, PA and other RF circuits and modules based on CMOS/SOI process;
2. Responsible for RF device and circuit layout design and post-imitation and packaging simulation verification, participating in RF device modeling and material design;
3. Responsible for test verification and laboratory debugging of RF circuits and modules;
4. Write product manuals, application documents, etc.
Job Requirements
1. Graduate degree or above, semiconductor physics and microelectronics and other related majors;
2. Familiar with related knowledge of microwave radio frequency/electromagnetic field, analog circuit, signal and system, communication system;
3. Familiar with the semiconductor (CMOS/SOI/GaAs/SiGe, etc.) process;
4. Skilled use of design tools such as ADS, Cadence and common test equipment, strong layout design experience and circuit test analysis ability;
5. Outstanding hands-on and active learning ability, good communication/teamwork ability;
6. Those with the following experience are preferred:
a. Have complete PA Module/LNA/Switch product development experience;
b. Proficient in laboratory test equipment operation and process;
c. Familiar with semiconductor devices, materials and processes;
d. Familiar with passive device design.
Please send your resume to this email: HR@radrocktech.com
RF System Engineer
Number of recruits: 2
2023.06.08
Work location: Shenzhen
Job Responsibilities
1. Responsible for the research and design of mobile phone RF new circuit system and architecture;
2. Responsible for defining the indicators of each module of the mobile phone radio frequency link and performing link calculation;
3. Create a design and verification strategy for the mobile phone RF system;
4. Test and verification of RF chip implementation (according to mobile phone RF system requirements and 3GPP requirements)
5. Based on the feedback from the designer, review the system specification trade-offs;
6. Analyze and find out the key bottlenecks in the circuit system design.
Job Requirements
1. Master degree or above in microwave electronics, electronic engineering, computer science or related majors;
2. Work experience in mobile phone company (HOVM) and 3 years or more;
3. Understand the indicators of each module of the RF link such as LNA, PA, Filter, VGA, MIXER, VCO, PLL;
4. Calculate RF link performance, including RF gain/power budget, cascade noise analysis, linear performance, frequency planning, power consumption, control functions, etc.
5. Have a strong teamwork spirit and can communicate with the design team efficiently to ensure high-quality completion of the work.
Please send your resume to this email: HR@radrocktech.com
Job Responsibilities
1. Responsible for the research and design of mobile phone RF new circuit system and architecture;
2. Responsible for defining the indicators of each module of the mobile phone radio frequency link and performing link calculation;
3. Create a design and verification strategy for the mobile phone RF system;
4. Test and verification of RF chip implementation (according to mobile phone RF system requirements and 3GPP requirements)
5. Based on the feedback from the designer, review the system specification trade-offs;
6. Analyze and find out the key bottlenecks in the circuit system design.
Job Requirements
1. Master degree or above in microwave electronics, electronic engineering, computer science or related majors;
2. Work experience in mobile phone company (HOVM) and 3 years or more;
3. Understand the indicators of each module of the RF link such as LNA, PA, Filter, VGA, MIXER, VCO, PLL;
4. Calculate RF link performance, including RF gain/power budget, cascade noise analysis, linear performance, frequency planning, power consumption, control functions, etc.
5. Have a strong teamwork spirit and can communicate with the design team efficiently to ensure high-quality completion of the work.
Please send your resume to this email: HR@radrocktech.com
PJM
Number of recruits: 1
2023.06.08
Work location: Shenzhen
Job Responsibilities
1. Participate in assisting and following up the project progress, communicating and coordinating various details in the product development process;
2. Participate in the coordination of the market operation preparation work before the product goes online, including the final version data of the preliminary development materials;
3. Collect and feedback customers' opinions on products in a timely manner, and arrange product optimization plans;
Job Requirements
1. Bachelor degree or above, about 5 years of experience as an NPI engineer or packaging process engineer;
2. Familiar with the packaging and testing process of IC products, with the ability to find and solve problems in the packaging and testing production process, RF products are preferred, and have a certain understanding of product packaging forms, basic forms and applications;
3. Familiar with IC product reliability testing standards and methods;
4. Understand the reliability testing process of new product verification and mass production monitoring (ORT).
Please send your resume to this email: HR@radrocktech.com
Job Responsibilities
1. Participate in assisting and following up the project progress, communicating and coordinating various details in the product development process;
2. Participate in the coordination of the market operation preparation work before the product goes online, including the final version data of the preliminary development materials;
3. Collect and feedback customers' opinions on products in a timely manner, and arrange product optimization plans;
Job Requirements
1. Bachelor degree or above, about 5 years of experience as an NPI engineer or packaging process engineer;
2. Familiar with the packaging and testing process of IC products, with the ability to find and solve problems in the packaging and testing production process, RF products are preferred, and have a certain understanding of product packaging forms, basic forms and applications;
3. Familiar with IC product reliability testing standards and methods;
4. Understand the reliability testing process of new product verification and mass production monitoring (ORT).
Please send your resume to this email: HR@radrocktech.com
Key Account Sales Manager
Number of recruits: 3
2023.06.08
Job Responsibilities:
1. Formulate and implement market sales plans, sort out customer needs and forecasts, formulate sales strategies, actively obtain orders, and ensure the completion of sales performance;
2. Investigate the market, analyze customers, understand competitors and competitors, and form written reports for regular discussion;
3. Manage Design-In and Design-Win processes, as well as successful mass production of Design-Win;
4. Assist the FAE/QE team to do a good job in customer service and related support work;
5. Keep abreast of the R&D progress of the company's new products, and be familiar with the R&D supporting process;
6. Establish and maintain the latest customer files, advise and manage customer partnerships, ensure that customers are provided with quality services, and are recognized by customers;
7. Complete the work tasks temporarily assigned by the superior.
Job requirements:
1. College degree or above, more than 3 years of experience in sales or channel sales of key customers in RF module or RF IC industry;
2. Sales experience in serving mobile phone brand customers (Xiaomi, OPPO, vivo, Honor, etc.), mobile phone ODM customers (Huaqin, Longqi, Wingtech, etc.) and IoT customers (Quectel, Youfang, Guanghetong) is preferred;
3. Familiar with wireless communication RF microwave product experience, familiar with power amplifiers, gain modules, RF switches, low noise amplifiers and other RF device markets;
4. Love sales work, energetic, strong pressure resistance, dare to fight.
Please send your resume to this email address: HR@radrocktech.com
1. Formulate and implement market sales plans, sort out customer needs and forecasts, formulate sales strategies, actively obtain orders, and ensure the completion of sales performance;
2. Investigate the market, analyze customers, understand competitors and competitors, and form written reports for regular discussion;
3. Manage Design-In and Design-Win processes, as well as successful mass production of Design-Win;
4. Assist the FAE/QE team to do a good job in customer service and related support work;
5. Keep abreast of the R&D progress of the company's new products, and be familiar with the R&D supporting process;
6. Establish and maintain the latest customer files, advise and manage customer partnerships, ensure that customers are provided with quality services, and are recognized by customers;
7. Complete the work tasks temporarily assigned by the superior.
Job requirements:
1. College degree or above, more than 3 years of experience in sales or channel sales of key customers in RF module or RF IC industry;
2. Sales experience in serving mobile phone brand customers (Xiaomi, OPPO, vivo, Honor, etc.), mobile phone ODM customers (Huaqin, Longqi, Wingtech, etc.) and IoT customers (Quectel, Youfang, Guanghetong) is preferred;
3. Familiar with wireless communication RF microwave product experience, familiar with power amplifiers, gain modules, RF switches, low noise amplifiers and other RF device markets;
4. Love sales work, energetic, strong pressure resistance, dare to fight.
Please send your resume to this email address: HR@radrocktech.com
System Engineer
Number of recruits: 1
2023.06.08
Job Responsibilities:
1. Responsible for formulating PA/LNA/SOI/Filter specifications and test methods for RF front-end components (2G/3G/4G/5G/WiFi/GPS/IoT);
2. Responsible for assisting the marketing department to plan the advanced radio frequency front-end (RFFE) architecture (performance improvement and cost reduction);
3. Responsible for updating new communication systems (6G) and protocols (3GPP, IEEE, mipi RFFE) and writing them into internal guidance documents
4. Responsible for the writing and maintenance of specifications and application instructions;
5. Responsible for the technical assistance of other departments (R&D, testing, quality).
Job requirements:
1. Master degree or above; Electronic engineering, microwave radio frequency, microelectronics, electronic information science and technology, communication and other related majors;
2. At least 5 years of relevant work experience;
3. Proficient in RF transceiver RFIC architecture and internal circuit specifications;
4. Proficient in 3GPP/IEEE 802.11 and other communication protocol standards;
5. Familiar with the corresponding specifications of product applications and the configuration and advantages and disadvantages of mainstream 5G RFFE architecture;
6. Familiar with business communication protocols IOT/GPS/WIFI/BT/LTE/5G/WIFI/UWB, etc.;
7. Familiar with safety test FCC, SRRC, CE, etc.;
8. Familiar with advanced RF technologies DPD Digital Pre-Distortion, ET Envelope Tracking, Antenna Tuner;
9. Familiar with semiconductor manufacturing process and production process (GaAs, SOI, CMOS, pHEMT etc.);
10. Familiar with electronic component reliability (HTOL, bHAST, ESD).
Please send your resume to this email address: HR@radrocktech.com
1. Responsible for formulating PA/LNA/SOI/Filter specifications and test methods for RF front-end components (2G/3G/4G/5G/WiFi/GPS/IoT);
2. Responsible for assisting the marketing department to plan the advanced radio frequency front-end (RFFE) architecture (performance improvement and cost reduction);
3. Responsible for updating new communication systems (6G) and protocols (3GPP, IEEE, mipi RFFE) and writing them into internal guidance documents
4. Responsible for the writing and maintenance of specifications and application instructions;
5. Responsible for the technical assistance of other departments (R&D, testing, quality).
Job requirements:
1. Master degree or above; Electronic engineering, microwave radio frequency, microelectronics, electronic information science and technology, communication and other related majors;
2. At least 5 years of relevant work experience;
3. Proficient in RF transceiver RFIC architecture and internal circuit specifications;
4. Proficient in 3GPP/IEEE 802.11 and other communication protocol standards;
5. Familiar with the corresponding specifications of product applications and the configuration and advantages and disadvantages of mainstream 5G RFFE architecture;
6. Familiar with business communication protocols IOT/GPS/WIFI/BT/LTE/5G/WIFI/UWB, etc.;
7. Familiar with safety test FCC, SRRC, CE, etc.;
8. Familiar with advanced RF technologies DPD Digital Pre-Distortion, ET Envelope Tracking, Antenna Tuner;
9. Familiar with semiconductor manufacturing process and production process (GaAs, SOI, CMOS, pHEMT etc.);
10. Familiar with electronic component reliability (HTOL, bHAST, ESD).
Please send your resume to this email address: HR@radrocktech.com
RF Device Application Engineer
Number of recruits: 1
2023.06.08
Job Responsibilities:
1. Responsible for the analysis of product PA/LNA/SWITCH mobile phone or WIFI characteristics and market competitiveness.
2. Responsible for outputting product RFFE (RF front-end) board-level test report and analyzing test data.
3. Responsible for planning and implementing product system and test plan.
4. Responsible for the introduction of new products.
5. Responsible for writing product application instructions.
6. Assist customers to solve product application problems with FAE, analyze and output reports.
7. Responsible for formulating new product specifications and indicators with the marketing department.
8. Assist the quality department to analyze the market failure products and output the report.
Job requirements:
1. Bachelor degree or above; Electronic engineering, microwave radio frequency, microelectronics, electronic information science and technology, communication and other related majors;
2. At least 5 years of relevant work experience;
3. Familiar with RF theory, communication system concept, welding ability, familiar with RF instrument operation, network analyzer, spectrum analyzer, comprehensive tester, etc.;
4. Proficient in mobile phone 2G/3G/5G or WIFI communication protocols and regulatory measures (3GPP, IEEE 802.xx, PTCRB, SRRC, FCC, CE and other certification protocols);
5. Work proactively, have a good sense of teamwork and strong internal and external communication skills.
Please send your resume to this email address: HR@radrocktech.com
1. Responsible for the analysis of product PA/LNA/SWITCH mobile phone or WIFI characteristics and market competitiveness.
2. Responsible for outputting product RFFE (RF front-end) board-level test report and analyzing test data.
3. Responsible for planning and implementing product system and test plan.
4. Responsible for the introduction of new products.
5. Responsible for writing product application instructions.
6. Assist customers to solve product application problems with FAE, analyze and output reports.
7. Responsible for formulating new product specifications and indicators with the marketing department.
8. Assist the quality department to analyze the market failure products and output the report.
Job requirements:
1. Bachelor degree or above; Electronic engineering, microwave radio frequency, microelectronics, electronic information science and technology, communication and other related majors;
2. At least 5 years of relevant work experience;
3. Familiar with RF theory, communication system concept, welding ability, familiar with RF instrument operation, network analyzer, spectrum analyzer, comprehensive tester, etc.;
4. Proficient in mobile phone 2G/3G/5G or WIFI communication protocols and regulatory measures (3GPP, IEEE 802.xx, PTCRB, SRRC, FCC, CE and other certification protocols);
5. Work proactively, have a good sense of teamwork and strong internal and external communication skills.
Please send your resume to this email address: HR@radrocktech.com